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| Leistungsstarke IR-Lumineszenzdiode High Power Infrared Emitter Lead (Pb) Free Product - RoHS Compliant SFH 4202 Vorlaufige Daten / Preliminary Data Wesentliche Merkmale * Leistungsstarke GaAs-LED (35 mW) * Hoher Wirkunsgrad bei kleinen Stromen * Hohe Fluss-Strome bei hohen Temperturen moglich * Homogene Abstrahlung * Typische Peakwellenlange 950nm Anwendungen * Schnelle Datenubertragung mit Ubertragungsraten bis 100 Mbaud (IR Tastatur, Joystick, Multimedia) * Analoge und digitale Hi-Fi Audio- und Videosignalubertragung * Alarm- und Sicherungssysteme * IR Freiraumdatenubertragung * IR-Scheinwerfer fur Kameras Features * High Power GaAs-LED (35 mW) * High Efficiency at low currents * High Forward current possible at high temperatures * Homogeneous Radiation Pattern * Typical peak wavelength 950nm Applications * High data transmission rate up to 100 Mbaud (IR keyboard, Joystick, Multimedia) * Analog and digital Hi-Fi audio and video signal transmission * Alarm and safety equipment * IR free air data transmission * IR spotlight for cameras Typ Type SFH 4202 1) Bestellnummer Strahlstarkegruppierung 1) (IF = 100 mA, tp = 20 ms) Ordering Code Radiant Intensity Grouping 1) Ie (mW/sr) on request 10 ( 4) gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr 2005-02-25 1 SFH 4202 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Durchlassstrom Forward current Stostrom, tp = 10 s, D = 0 Surge current Verlustleistung Power dissipation Symbol Symbol Wert Value - 40 ... + 100 3 100 2.2 180 300 Einheit Unit C V mA A mW K/W Top; Tstg VR IF (DC) IFSM Ptot Warmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgroe je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Warmewiderstand Sperrschicht - Lotstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block 130 K/W 2005-02-25 2 SFH 4202 Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA, tp = 20 ms Abstrahlwinkel Half angle Aktive Chipflache Active chip area Abmessungen der aktiven Chipflache Dimensions of the active chip area Symbol Symbol peak Wert Value 950 Einheit Unit nm 40 nm 60 0.09 0.3 x 0.3 10 Grad deg. mm2 mm ns A LxB LxW Schaltzeiten, Ie von 10% auf 90% und von 90% tr, tf auf 10%, bei IF = 100 mA, tp = 20 ms, RL = 50 Switching times, e from 10% to 90% and from 90% to10%, IF = 100 mA, tp = 20 ms, RL = 50 Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s Sperrstrom Reverse current VR = 3 V Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms VF VF IR 1.5 ( 1.8) 3.2 ( 4.3) 0.01 ( 10) V V A e 35 mW Temperaturkoeffizient von Ie bzw. e, TCI IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA - 0.44 %/K TCV TC - 1.5 + 0.2 mV/K nm/K 2005-02-25 3 SFH 4202 Strahlstarke Ie in Achsrichtung gemessen bei einem Raumwinkel = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Strahlstarke Radiant intensity IF = 1 A, tp = 100 s Symbol Ie min. Ie typ. Ie typ. Werte Values 4 10 60 Einheit Unit mW/sr mW/sr mW/sr 2005-02-25 4 SFH 4202 Relative Spectral Emission Irel = f () 100 OHF00777 Radiant Intensity Ie = f (IF) Ie 100 mA Single pulse, tp = 20 s 10 2 e e (100 mA) OHF00809 Max. Permissible Forward Current IF = f (TA) 120 mA OHL01293 erel 80 I F 100 80 60 10 0 60 40 10 -1 40 20 10 -2 20 TA temp. ambient 0 800 850 900 950 1000 nm 1100 10 -3 10 0 10 1 10 2 10 3 mA 10 4 F 0 0 20 40 60 80 C 100 TA Forward Current IF = f (VF) single pulse, tp = 20 s 10 4 mA 10 3 OHF00784 Permissible Pulse Handling Capability IF = f (), TA = 25 C, duty cycle D = parameter IF 101 A 5 OHF00040 F P D= T t tP IF T D= 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1 10 2 10 1 10 0 100 5 10 -1 10 -2 10 -3 0 0.5 1 1.5 2 2.5 3 3.5 V 4.5 10-1 -5 10 10-4 10-3 10-2 10-1 100 101 s 10 2 VF tp 10 0 Radiation Characteristics Irel = f ( 40 30 20 OHL01660 1.0 50 0.8 0.6 60 0.4 70 0.2 80 90 100 1.0 0.8 0.6 0.4 0 20 40 60 80 100 120 0 2005-02-25 5 SFH 4202 Mazeichnung Package Outlines 3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 0.8 (0.031) 0.6 (0.024) 2.1 (0.083) A A 3.7 (0.146) 3.3 (0.130) 41 2.1 (0.083) 1.7 (0.067) 0.9 (0.035) 0.7 (0.028) 0.1 (0.004) (typ.) A A (2.4) (0.095) 3.4 (0.134) 3.0 (0.118) 1.1 (0.043) A C Package marking 0.5 (0.020) 0.6 (0.024) 0.4 (0.016) A C 0.18 (0.007) 0.12 (0.005) GPLY6084 Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch) Anode: see marking "A" in drawing 2005-02-25 6 SFH 4202 Empfohlenes Lotpaddesign Recommended Solder Pad IR Flow Loten IR Reflow Soldering Flache darf elektrisch nicht beschaltet werden. Do not use this area for electrical contact. 3.3 (0.130) Anode 3.3 (0.130) Padgeometrie fur verbesserte Warmeableitung Paddesign for improved heat dissipation 2.3 (0.091) 0.8 (0.031) 1.1 (0.043) 0.7 (0.028) Kathode/ Cathode Flache darf elektrisch nicht beschaltet werden. Do not use this area for electrical contact. Lotstoplack Solder resist _ Cu Flache / < 16 mm 2 per pad Cu-area 11.1 (0.437) 3.7 (0.146) 1.5 (0.059) OHLPY440 Empfohlenes Lotpaddesign Recomended Solder Pad Wellenloten (TTW) TTW Soldering Flache darf elektrisch nicht beschaltet werden. Do not use this area for electrical contact. 2 (0.079) Anode 6.1 (0.240) 2.8 (0.110) 2 (0.079) 3 (0.118) 2 (0.079) 2.8 (0.110) Padgeometrie fur verbesserte Warmeableitung Paddesign for improved heat dissipation 0.5 (0.020) Kathode/ Cathode Cu Flache / > 16 mm 2 per pad Cu-area Lotstoplack Solder resist OHAY1583 Flache darf elektrisch nicht beschaltet werden. Do not use this area for electrical contact. 2005-02-25 7 Bewegungsrichtung der Platine PCB-direction 6 (0.236) 1 (0.039) SFH 4202 Lotbedingungen Soldering Conditions IR-Reflow Lotprofil fur bleifreies Loten IR Reflow Soldering Profile for lead free soldering 300 C 255 C 240 C 217 C 200 30 s max 150 120 s max 100 Ramp Up 3 K/s (max) 25 C 0 0 50 100 150 200 250 s 300 100 s max Ramp Down 6 K/s (max) 10 s min Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020B) (acc. to J-STD-020B) OHLA0687 T 250 Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile C 260 C +0C -5 245 C 5 C C 235 C +5C -0 50 min. condition for IR Reflow Soldering: solder point temperature 235 C for at least 10 sec. t Wellenloten (TTW) TTW Soldering 300 C T 250 235 C ... 260 C 2. Welle 2. wave 200 1. Welle 1. wave 150 100 C ... 130 C 100 2 K/s 50 Zwangskuhlung forced cooling ca 200 K/s 5 K/s 2 K/s (nach CECC 00802) (acc. to CECC 00802) OHLY0598 10 s Normalkurve standard curve Grenzkurven limit curves 0 0 50 100 150 t 200 s 250 2005-02-25 8 SFH 4202 Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2005-02-25 9 |
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